On Monday, June 1, 2026, Foxconn, Radiall and Thales laid the foundation stone for their future joint venture at Le Barp (Nouvelle-Aquitaine) as part of the Choose France 2026 Summit, in the presence of the French Minister Delegate to the Minister of Industry, Mr. Sébastien Martin, the President of S Business Group for Hon Hai Technology Group (Foxconn), Dr. Bob Wei-Ming Chen, the Chairman and CEO of Radiall, Mr. Pierre Gattaz, the Chairman and CEO of Thales, Mr. Patrice Caine and the President of the Nouvelle-Aquitaine Region, Mr. Alain Rousset.
This company, called Tessalia Technology SAS, will be dedicated to Outsourced Semiconductor Assembly and Testing (OSAT). It aims to produce more than 50 million System in Package (SiP) components per year by 2033.
Within the framework of the EU Chips Act, this project represents a major step forward in strengthening the French and European semiconductor ecosystem, increasing its capacity for innovation, strategic autonomy and competitiveness.
“Today’s announcement proves that in one year, from one Choose France summit to the other, a strategic project successfully turned its vision into action, by choosing Le Barp to install a unique factory in Europe that complements the semiconductors value chain and strengthens European sovereignty. Foxconn’s decision, along with Thales and Radiall, signals confidence in France”s attractiveness as a technological and industrial hub for semi-conductors. ” said Sébastien Martin, Minister of Industry.
“This new advanced capacity is a key sovereign asset for the European and French semiconductor industry. This project aligns perfectly with Radiall’s strategy, enabling the development of our next advanced connection solutions for demanding applications.” Pierre Gattaz, Chairman and CEO. Radiall
“This is not just a factory. It is a strategic platform for advanced manufacturing, semiconductor resilience, and future technologies in Europe. This project also supports Foxconn’s strategy of Build-Operate-Localize, which expands our global technology footprint through trusted partnerships.” Young Liu, Chairman, Foxconn
“The laying of this first stone today demonstrates our shared ambition, together with Radiall and Foxconn, to build an innovative and competitive European player in the advanced semiconductor packaging market, in a context of strong competition. Tessalia is part of a drive for independence and control over the value chain of all our electronic products.” Patrice Caine, Chairman and CEO, Thales
“I am delighted to welcome this strategic factory, which is crucial for our sovereignty in the electronics sector. It strengthens our regional ecosystem in this sector, which already represents 20,000 jobs. This project also rewards our long-standing efforts in reindustrialization, which have enabled us to become the leading region in France in terms of creating factories”. Alain Rousset, Président, Nouvelle-Aquitaine Region
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